metal matrix composites, controlled expansion, ce, ce, ce alloys, composite alloys, thermal, aluminum graphite, graphite aluminum, copper, copper graphite, cu/gr, gr/cu, al/gr, gr/al, electronics cooling, thermal management, microelectronic packaging, power modules, advanced microelectronics, precision aluminum casting, aluminum casting, composites, graphite fiber composites, low cte, aln, alumina, al2o3, electronics thermal management, thermal management materials, thermal management materials, thermal management materials, metal matrix composites, alsic, metgraf, metsic, aluminum silicon carbide, thermal management, thermal solutions, heat sinks, microprocessor lids, microprocessor thermal management, flip chips, flipchips, lids, igbt, igbt thermal management, igbt base plate, igbt baseplates, baseplates, matched cte,cte, thermal conductivity, high thermal, net shape, near net shape, diamond, light weight, aluminum silicon carbide, al/sic, mmc, mmc, cumo, copper molybdenum, cuw, copper tungsten, kovar, silvar, electronic packages, power substrates, heat sink, heatsink, electronics, electronics cooling

engineered metal matrix composites for reserch, industry and defense.